Pre-Heater for BGA Re-Work System, Temperature Controlled

About.

Model: 853 ESD, PRE-HEATER FOR B.G.A. RE-WORK SYSTEM, Temp., Controlled. 460 W, 120 ℃ ~ 250 ℃ 1. Rapid heating, only 10s to reach 250 ℃. 2. Built-in temperature sensor, stable output temperature. 3. Cool or hot air can be selected to pre-heat or cool chips. 4. The preheater can be used with rework stations to process BGA or other flake ICs. Fixture for B.G.A Re-Work System which can hold PCBs for B.G.A Re-work. 850 Series S.M.D Re-work Stations/Systems can be connected at the top and 853 Pre-Heater can be placed below the PCB. Vacuum Pickup Model 381 A can be used to pickup/hold the components.

• Rapid heating: only 10 s to reach 250 ℃
• Built-in temperature sensor for stable output temperature
• Cool or hot air selectable to pre-heat or cool chips
• Works with re-work stations to process BGA and other flat ICs

Specifications.

Power

460 W

Temperature range

120 ℃ ~ 250 ℃

Heat-up

10 s to reach 250 ℃

Pre-heat / cool

Cool or hot air selectable